Xilinx公司的芯片在热设计方面可以提供哪些工具和资料？

For thermal consideration, you need to know the power consumption of your FPGA and the thermal resistivity of the device package you are using. The power consumption can be estimated by the XPower tool included in Xilinx ISE software. The thermal resistivity of the device package can be found in Xilinx databook. The junction temperature can then be calculated by the following formula（至于散热问题, 需要了解所用FPGA的功耗和正在使用的器件封装的热阻系数. Xilinx ISE软件中所包含的Xpower工具可以估计功耗. 在Xilinx数据手册中可以找到器件封装的热阻系数. 然后利用下面的公式计算接合温度. ）

Xilinx数据手册中可以找到器件封装的热阻系数